Facilities
Fuji Assembly Lines
Wafer of ICs for chip-on-board process
Through-hole soldering
Thermotron Air to air temperature
cycling chamber
Spectrum analyzer with
modulation analysis
SMT Pick and place (chipshooter)
SMT fine-pitch placer
SMT – BGA removal and replacement with controlled reflow profile
Molex Terminal Crimping Press TM42D
Mixed-technology In-process
SMT feeders
Surface Mount Technology
Mirtec Benchtop AOI Machine
Machine shop
JST crimping press
Ezform LV 1827 Vacuum Forming Machine
Hewlett Packard Network Analyzer and S-Parameter test set
Engineering test lab
Jade Handex Selective Solder Machine
Design lab – debugging
– verification testing
Custom overmolding – encapsulation
Custom mold fabrication
Custom clamshell functional test fixture
Connector crimping process
CNC Turning process
CNC Milling Machine
Branson Sonic Power Co.
Ultrasonic Welder Series 800
Asymtek Glue dispensing system
